PCB
PCB service items
Entire process of PCB fabrication
Special
Applications

CASE
PCB application and case
Communication product

Specification
TG180 / 6L / 1.6mm/ENIG 3U. / Gold finger beveled edge electroplated gold finger 25u” / Resin plug hole (11.99mil) / Impedance control

Specification
TG158 / 14L / 1.6mm / solder mask green / silver / impedance control
Resin plug hole/ Beveling of Gold finger (gold electroplated) 25μ
Resin plug hole/ Beveling of Gold finger (gold electroplated) 25μ

Specification
6L / TU883 / HDI / 0.8mm±0.1mm / solder mask green / text white / ENIG 2u nickel 180u / impedance control / beveling of G/F

Specification
TU-883sp / 6L / t 1.57mm±0.15mm / ENIG 2u / Resin plug hole / Gold finger 15u / Impedance control within ±10% / Gold finger front-end lead angle needs to be 30 degrees / Board edge processing requires blind fishing

Specification
TU-862 HF (halogen-free) /8L/1.0mm/1oz/solder mask: green/ENIG5u/Resin plug hole/impedance control

Specification
FR4(halogen-free)/6L/0.8mm/1oz/green white/V-Cut/ink plug hole/ENIG/impedance test
Test board

Specification
Laser paint removal

Specification
FR4 / 4L / 1.0mm / 1oz / HASL / Solder mask white / Text black / Impedance control / V-CUT

Specification
TU-883SP+NP-175 / 6L / 1.57mm±10% /Resin plug hole /ENIG 2u / gold finger / impedance
Control 50 & 100 ohm (2models combined)
Control 50 & 100 ohm (2models combined)

Specification
FR4(TG170) / 10L / 1.6mm±10% / ENIG 2u nickel 180u / Resin plug hole / impedance control
Computer

Specification
FR4 / 2L / 1.6mm / solder mask black / HASL / shipped in pieces

Specification
FR4 / 4L / 1.2mm / solder mask green / text white /HASL
Impedance control 80ohm&90oh
Impedance control 80ohm&90oh

Specification
1.6mm / 16L / ENIG / impedance control /Resin plug hole / back drill / jump knife

Specification
1.6mm / 16L / ENIG / impedance control /Resin plug hole / back drill / jump knife

Specification
1.6mm / 16L / ENIG / impedance control /Resin plug hole / back drill / jump knife

Specification
8L / 1.6mm / ENIG / Resin plug hole

Specification
8L / FR4(Halogen Free) / 1.6mm / Blue solder mask Impedance Control / Immersion Gold / Gold Finger 40u(min.)

Specification
10L / HDI(2+4+2) / 1.6mm/ ENIG 2u
NFC sensing

Specification
FR4/ 2L / t1.6mm / 1oz / solder mask white / HASL /with board stamp holes
Hole diameter: diameter 0.5mm * 3pcs
Hole diameter: diameter 0.5mm * 3pcs

Specification
FR4 / 0.4mm / 2L /ENIG / 1oz

Specification
FR4 / 1.2mm / 2L /HASL/ 1oz
V-cut
V-cut

Specification
FR4/ 2L / t1.6mm / 1oz / solder mask white / HASL /with board stamp holes
0.5mm*3pcs
0.5mm*3pcs
Car bluetooth module

Specification
2L / FR4 / 0.8mm / 藍白 / 化金2u / 阻抗控制/半孔撈開、不V-CUT / 樹塞

Specification
4L / FR4 / 0.8mm / 藍白 / 化金2u/ 阻抗控制/半孔撈開、不V-CUT/連板設計修改(單板旋左旋轉90度)。

Specification
FR4 / 4L / 0.8mm / 化金2u / 銅厚1oz / 樹塞 / 藍白 / 阻抗控制-50ohm-8/7/8mil / 半孔撈開不V-CUT

Specification
6L / FR4 / HDI(雷鑽+電鍍填孔+樹塞) / 0.8mm / 藍白阻抗控制 / 半孔撈開(不V-CUT) / 化金2u
AI face recognition

Specification
FR4 / 4L / 1.0mm / 1oz/ solder mask green / ENIG 1U

Specification
FR4 / 4L / 1.0mm / 1oz/ solder mask green / ENIG 1U

Specification
FR4/4L/1.0mm/1oz/ENIG/Resin plug hole/0.15mm drilling

Specification
HDI / FR4 / 8L / 1.2mm / 防焊綠色 / 化金2u

Specification
FR4/8L/1.6mm/ENIG/3/3mil line width
Power

Specification
4L/FR4/1.0mm/綠色防焊/化金2u/樹塞/半孔撈開+V‐CUT

Specification
6L/FR4/1.0mm/綠色防焊/化金2u/樹塞/半孔撈開+V‐CUT
Camera

Specification
FR4 / 2L / 1.6mm / matte black /ENIG / V-CUT+CNC/ no folding required
Electronic locks

Specification
FR4 / 4L / t 1.0mm /ENIG / 1oz
IC test board

Specification
4L/RO4350B/0.8mm/ ENIG 5u / inside and outside 1oz / Resin plug hole / copper plug / V-CUT+CNC / impedance control
Network recovery card

Specification
FR4 / 4L / t 1.2mm /ENIG / impedance control 100ohm
Military + gold thread

Specification
2L/FR4 / 2L / 1.6mm / 1oz / 綠白 / 化金3u/打金線
FPC application and case
Test board

Specification
2L / FPC / 1.55mm+/-0.1mm / ENIG / no reinforcement

Specification
FPC / 2L / 0.1mm / gold finger /ENIG / Hoz
Power

Specification
FPCB / 1L / 0.16mm
FCCL: 2mil 1oz ;CVL: 1mil Ad:35um
Finish: Immersion Tin
FCCL: 2mil 1oz ;CVL: 1mil Ad:35um
Finish: Immersion Tin

Specification
FPCB / 2L / 0.16mm
FCCL: 2mil 1/2oz(2 layer) ;CVL: 1mil Finish: Immersion Gold 2u” ;CVL: Lase
FCCL: 2mil 1/2oz(2 layer) ;CVL: 1mil Finish: Immersion Gold 2u” ;CVL: Lase
NFC sensing

Specification
FPC / PI / 0.13mm /0.2mm / 1/1oz /ENIG
* Both hemming and single PCS are added with reinforcing plate (0.8mm)
*Yellow cover layer
* Both hemming and single PCS are added with reinforcing plate (0.8mm)
*Yellow cover layer

Specification
FPC / PI / 2L / 0.13mm / 0.5oz /ENIG
*Single PCS is reinforced with board (0.4mm)
*White cover layer
*Single PCS is reinforced with board (0.4mm)
*White cover layer

Specification
PI (FPC)/ 0.13mm / 2L / ENIG / 0.5oz/ Solder mask yellow / Reinforcement plate: 9 * 17.5mm
t0.4mm
t0.4mm
Communication product

Specification
FPCB / Copper thickness 0.5oz / ENIG 2u / Impedance control 100Ω

Specification
FPC / 2L / 0.19mm /ENIG
PI reinforcement at specified location
PI reinforcement at specified location
Camera

Specification
FR4/ 2L / t1.6mm / 1oz / solder mask white / HASL /with board stamp holes
Hole diameter: diameter 0.5mm * 3pcs
Hole diameter: diameter 0.5mm * 3pcs
Rigid-Flex PCB application and case
Camera

Specification
Rigid Flex
8L_HDI(4Ri+2F+4Ri)
1.0mm
ENIG
Green solder
FPC with gold fingers + reinforcement boards
8L_HDI(4Ri+2F+4Ri)
1.0mm
ENIG
Green solder
FPC with gold fingers + reinforcement boards

Specification
RigidFlex /10L(HDI L1-2, L2-9, L9-10)+2L(FPC) / 1.0mm
ENIG
ENIG

Specification
RigidFlex_10L(HDI) / 1.0mm /ENIG

Specification
Rigid-Flex /6L(2+2F+2) /0.635mm (including soft board 0.25mm/ENIG
Resin plug hole/Impedance control
Resin plug hole/Impedance control
Medical wearable device

Specification
Rigid_Flex / 2L / T=1.0mm / ENIG

Specification
Rigid_Flex / 4L(2L) Anylayer / 化金 / 0.376mm / 綠白

Specification
Rigid_Flex / 4L anylayer / T=0.38mm / ENIG
Basic Process Flow
Multi-Layer
Cutting Laminates
Cutting
Laminates
Laminates
內線
Making
Inner Layers
Inner Layers
壓合
Lamination
鑽孔
Driling
電鍍通孔
Plated
Through Hole
外線
Making
Externa Layers
Externa Layers
二銅
Tenting
Electrolytic
Copper Plating
Electrolytic
Copper Plating
防焊
SolderMask
Printing
Printing
表面處理
Surface
Treatment
Treatment
文字
SilkScreen
成型
CNC
Routing
Routing
Electrica Test
Electrica Test
Process capability
PCB process capability
FPC process capability
Machine and Certification
Machine and Certification
ISO9001 International quality system Certification
ISO14001 International environmental management system Certification
AS9100 aerospace Certification
IATF16949 Automotive Certification
ISO14001 International environmental management system Certification
AS9100 aerospace Certification
IATF16949 Automotive Certification






