PCB

PCB service items

Entire process of PCB fabrication

Single-sided and double-sided PCB

Multi-layered PCB (4L-26L)

Advanced and multi-layered PCB

Microwave and high frequency PCB

Flexible PCB

Flex-Rigid PCB

Special

Resin plug hole

HDI

Back drilling

Coin process

Flexible PCB

Blind routing

Semi-plating hole

Applications

Automotive electronics

Industrial electronics

High frequency communication

Consumer electronic

Medical care

CASE

PCB application and case

Communication product

Specification

TG180 / 6L / 1.6mm/ENIG 3U. / Gold finger beveled edge electroplated gold finger 25u” / Resin plug hole (11.99mil) / Impedance control

Specification

TG158 / 14L / 1.6mm / solder mask green / silver / impedance control
Resin plug hole/ Beveling of Gold finger (gold electroplated) 25μ

Specification

6L / TU883 / HDI / 0.8mm±0.1mm / solder mask green / text white / ENIG 2u nickel 180u / impedance control / beveling of G/F

Specification

TU-883sp / 6L / t 1.57mm±0.15mm / ENIG 2u / Resin plug hole / Gold finger 15u / Impedance control within ±10% / Gold finger front-end lead angle needs to be 30 degrees / Board edge processing requires blind fishing

Specification

TU-862 HF (halogen-free) /8L/1.0mm/1oz/solder mask: green/ENIG5u/Resin plug hole/impedance control

Specification

FR4(halogen-free)/6L/0.8mm/1oz/green white/V-Cut/ink plug hole/ENIG/impedance test

Test board

Specification

Laser paint removal

Specification

FR4 / 4L / 1.0mm / 1oz / HASL / Solder mask white / Text black / Impedance control / V-CUT

Specification

TU-883SP+NP-175 / 6L / 1.57mm±10% /Resin plug hole /ENIG 2u / gold finger / impedance
Control 50 & 100 ohm (2models combined)

Specification

FR4(TG170) / 10L / 1.6mm±10% / ENIG 2u nickel 180u / Resin plug hole / impedance control

Computer

Specification

FR4 / 2L / 1.6mm / solder mask black / HASL / shipped in pieces

Specification

FR4 / 4L / 1.2mm / solder mask green / text white /HASL
Impedance control 80ohm&90oh

Specification

1.6mm / 16L / ENIG / impedance control /Resin plug hole / back drill / jump knife

Specification

1.6mm / 16L / ENIG / impedance control /Resin plug hole / back drill / jump knife

Specification

1.6mm / 16L / ENIG / impedance control /Resin plug hole / back drill / jump knife

Specification

8L / 1.6mm / ENIG / Resin plug hole

Specification

8L / FR4(Halogen Free) / 1.6mm / Blue solder mask Impedance Control / Immersion Gold / Gold Finger 40u(min.)

Specification

10L / HDI(2+4+2) / 1.6mm/ ENIG 2u

NFC sensing

Car bluetooth module

Specification

2L / FR4 / 0.8mm / 藍白 / 化金2u / 阻抗控制/半孔撈開、不V-CUT / 樹塞

Specification

4L / FR4 / 0.8mm / 藍白 / 化金2u/ 阻抗控制/半孔撈開、不V-CUT/連板設計修改(單板旋左旋轉90度)。

Specification

FR4 / 4L / 0.8mm / 化金2u / 銅厚1oz / 樹塞 / 藍白 / 阻抗控制-50ohm-8/7/8mil / 半孔撈開不V-CUT

Specification

6L / FR4 / HDI(雷鑽+電鍍填孔+樹塞) / 0.8mm / 藍白阻抗控制 / 半孔撈開(不V-CUT) / 化金2u

AI face recognition

Power

Camera

Electronic locks

IC test board

Network recovery card

Military + gold thread

FPC application and case

Test board

Specification

2L / FPC / 1.55mm+/-0.1mm / ENIG / no reinforcement

Specification

FPC / 2L / 0.1mm / gold finger /ENIG / Hoz

Power

NFC sensing

Specification

FPC / PI / 0.13mm /0.2mm / 1/1oz /ENIG
* Both hemming and single PCS are added with reinforcing plate (0.8mm)
*Yellow cover layer

Specification

FPC / PI / 2L / 0.13mm / 0.5oz /ENIG
*Single PCS is reinforced with board (0.4mm)
*White cover layer

Specification

PI (FPC)/ 0.13mm / 2L / ENIG / 0.5oz/ Solder mask yellow / Reinforcement plate: 9 * 17.5mm
t0.4mm

Communication product

Camera

Rigid-Flex PCB application and case

Camera

Specification

Rigid Flex
8L_HDI(4Ri+2F+4Ri)
1.0mm
ENIG
Green solder
FPC with gold fingers + reinforcement boards

Specification

RigidFlex /10L(HDI L1-2, L2-9, L9-10)+2L(FPC) / 1.0mm
ENIG

Specification

RigidFlex_10L(HDI) / 1.0mm /ENIG

Specification

Rigid-Flex /6L(2+2F+2) /0.635mm (including soft board 0.25mm/ENIG
Resin plug hole/Impedance control

Medical wearable device

Basic Process Flow

Multi-Layer

Cutting Laminates

Cutting
Laminates

內線

Making
Inner Layers

壓合

Lamination

鑽孔

Driling

電鍍通孔

Plated
Through Hole

外線

Making
Externa Layers

二銅

Tenting
Electrolytic
Copper Plating

防焊

SolderMask
Printing

表面處理

Surface
Treatment

文字

SilkScreen

成型

CNC
Routing

Electrica Test

Process capability

PCB process capability

FPC process capability

Machine and Certification

ISO9001 International quality system Certification
ISO14001 International environmental management system Certification
AS9100 aerospace Certification
IATF16949 Automotive Certification