SMT
SMT service items
SMT
Inspection and test
Back end process
Assembly
![Smt](https://pureetek.com/wp-content/uploads/2024/02/SMT.webp)
CASE
Applications and cases
![Water level gauge](https://pureetek.com/wp-content/uploads/2024/02/水位計.webp)
Water level gauge
![Automotive control panel](https://pureetek.com/wp-content/uploads/2024/02/車用控制面板.webp)
Automotive control panel
![車用控制面板 (1)](https://pureetek.com/wp-content/uploads/2024/02/車用控制面板-1.webp)
Automotive control panel
![Military spec controller](https://pureetek.com/wp-content/uploads/2024/02/軍規控制器.webp)
Military spec controller
![Test equipment](https://pureetek.com/wp-content/uploads/2024/02/測試設備.webp)
Test equipment
![測試設備 (1)](https://pureetek.com/wp-content/uploads/2024/02/測試設備-1.webp)
Test equipment
![Electronic door lock](https://pureetek.com/wp-content/uploads/2024/02/電子門鎖.webp)
Electronic door lock
![Connector](https://pureetek.com/wp-content/uploads/2024/02/Connector.webp)
Connector
![Fpc Light Bar](https://pureetek.com/wp-content/uploads/2024/02/FPC-Light-Bar.webp)
Fpc Light Bar
![Sim Socket](https://pureetek.com/wp-content/uploads/2024/02/sim-socket.webp)
Sim Socket
![Socket](https://pureetek.com/wp-content/uploads/2024/02/SOCKET-1.webp)
Socket
SMT Process Flow
SMT manufacturing process
Preparatory work
Get document
Make stencil
Make carrier and fixture
Material withdrawal
lQC
Code spraying on board
Baking for board material
Make stencil
Make carrier and fixture
Material withdrawal
lQC
Code spraying on board
Baking for board material
SMT
Solder paste printing
Solder paste thickness measurement
Furnace temperature measurement
Equipment material loading
Article placement
Inspection
Reflow
Inspection
FQC
Solder paste thickness measurement
Furnace temperature measurement
Equipment material loading
Article placement
Inspection
Reflow
Inspection
FQC
Back end process
DIP
Electrica Test
Dispensing
Cutting Laminates
Back glue attach
Assembly
Back process inspection
Electrica Test
Dispensing
Cutting Laminates
Back glue attach
Assembly
Back process inspection
Shipping
ОQС
Packaging
Transport
Packaging
Transport
Process capability
Item | Specification |
---|---|
Environmental Regulations | Lead-free and halogen-free throughout the entire process |
PCB types | Single-sided, double-sided, multilayer boards, aluminum substrate, flexible printed circuit boards (FPC)... all can be produced and processed |
Maximum Substrate Size | 600mm(L)*420mm(W) |
Maximum Substrate Thickness | 5.0mm |
Minimum Component Size | 01005Chip 0.2mm Pitch/Diameter Component |
Component Placement Accuracy | ±0.03mm |
Solder Paste Printing Accuracy | ±0.05mm(thickness, 0.02 for critical control) |
Production Capacity | 4.5KK Point / Day(SMT) |
DIP Hand Soldering Assembly Processing | YES |
Samples can be quickly delivered for approval | YES |
Professional full-process sample prototyping | YES |
SMT policy and Certification
Certification
ISO 9001
IATF 16949
ISO 14001
IATF 16949
ISO 14001
Environmental policy
Green production
Compliance with regulation
Pollution prevention
Continuous improvement
Compliance with regulation
Pollution prevention
Continuous improvement