SMT

SMT service items

SMT

PCB

FPC

Rigid-flex board

Inspection and test

Visual inspection

AOI

ICT

Back end process

Dispensing

Printing

DIP

Cutting Laminates

Assembly

Maintenance

Burn

Test

Assembly

Ultrasonic lamination

laser engraving

Printing

Labeling

CASE

Applications and cases

Water level gauge

Automotive control panel

Automotive control panel

Military spec controller

Test equipment

Test equipment

Electronic door lock

Connector

Fpc Light Bar

Sim Socket

Socket

SMT Process Flow

SMT manufacturing process

Preparatory work

Get document
Make stencil
Make carrier and fixture
Material withdrawal
lQC
Code spraying on board
Baking for board material

SMT

Solder paste printing
Solder paste thickness measurement
Furnace temperature measurement
Equipment material loading
Article placement
Inspection
Reflow
Inspection
FQC

Back end process

DIP
Electrica Test
Dispensing
Cutting Laminates
Back glue attach
Assembly
Back process inspection

Shipping

ОQС
Packaging
Transport

Process capability

Item	Specification
Environmental Regulations	Lead-free and halogen-free throughout the entire process
PCB types	Single-sided, double-sided, multilayer boards, aluminum substrate, flexible printed circuit boards (FPC)... all can be produced and processed
Maximum Substrate Size	600mm(L)*420mm(W)
Maximum Substrate Thickness	5.0mm
Minimum Component Size	01005Chip 0.2mm Pitch/Diameter Component
Component Placement Accuracy	±0.03mm
Solder Paste Printing Accuracy	±0.05mm(thickness, 0.02 for critical control)
Production Capacity	4.5KK Point / Day(SMT)
DIP Hand Soldering Assembly Processing	YES
Samples can be quickly delivered for approval	YES
Professional full-process sample prototyping	YES

SMT policy and Certification

Certification

ISO 9001
IATF 16949
ISO 14001

Environmental policy

Green production
Compliance with regulation
Pollution prevention
Continuous improvement